Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers-Reference-Cited by-同舟云学术

Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers

Published:2006-03-13 Issue:11 Volume:88 Page:111907
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Belyaev A.,Polupan O.,Dallas W.,Ostapenko S.,Hess D.,Wohlgemuth J.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.2186393

Reference13 articles.

1. J. Wohlgemuth, M. Narayanan, R. Clark, T. Koval, S. Roncin, M. Bennett, D. Cunningham, D. Amin, and J. Creager, Proceedings Conference Record of the 31st IEEE Photovoltaic Specialist Conference (IEEE, New York, 2005, p. 123.

2. A. Belyaev, O. Polupan, S. Ostapenko, D. Hess, and J. Kalejs, Department of Energy “Solar Energy Technologies” Program Review Meeting, Denver, October 2004.

3. Surface‐breaking fatigue crack detection using laser ultrasound

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