Diffusive void bifurcation in stressed solid
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.357471
Reference22 articles.
1. Electromigration in metals
2. Stress analysis of encapsulated fine‐line aluminum interconnect
3. Stress in metal lines under passivation; comparison of experiment with finite element calculations
4. Mechanisms of thermal stress relaxation and stress‐induced voiding in narrow aluminum‐based metallizations
5. Mechanical properties of thin films
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