Across wafer etch rate uniformity in a high density plasma reactor: Experiment and modeling-Reference-Cited by-同舟云学术

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Across wafer etch rate uniformity in a high density plasma reactor: Experiment and modeling

Published:1995-05 Issue:18 Volume:66 Page:2415-2417
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Surendra M.,Guarnieri C. R.,Selwyn G. S.,Dalvie M.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.113958

Reference12 articles.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of wafer impedance on the monitoring and control of ion energy in plasma reactors;Journal of Applied Physics;2006-09-15

2. Next-generation lithography mask development at the NGL-MCOC;SPIE Proceedings;2000-07-19

3. Experimental test of models of high-plasma-density, radio-frequency sheaths;Physical Review E;1999-01-01

4. Experimental test of models of radio-frequency plasma sheaths;Applied Physics Letters;1997-02-24

5. Planarity of large MEMS;Journal of Microelectromechanical Systems;1996-06

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