The interface formation of copper and low dielectric constant fluoro-polymer: Plasma surface modification and its effect on copper diffusion
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.369279
Reference27 articles.
1. Process Integration and Manufacturasility Issues for High Performance Multilevel Interconnect
2. Metal—organic chemical vapor deposition of copper using hydrated copper formate as a new precursor
3. Copper metallization for ULSL and beyond
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