Vacuum-gap transmon qubits realized using flip-chip technology-Reference-Cited by-同舟云学术

Vacuum-gap transmon qubits realized using flip-chip technology

Published:2021-11-01 Issue:18 Volume:119 Page:184003
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Li Xuegang¹^ORCID,Zhang Yingshan¹^ORCID,Yang Chuhong¹^ORCID,Li Zhiyuan¹,Wang Junhua¹,Su Tang¹,Chen Mo¹,Li Yongchao¹,Li Chengyao¹,Mi Zhenyu¹,Liang Xuehui¹,Wang Chenlu¹,Yang Zhen¹,Feng Yulong¹,Linghu Kehuan¹,Xu Huikai¹^ORCID,Han Jiaxiu¹,Liu Weiyang¹,Zhao Peng¹,Ma Teng¹,Wang Ruixia¹,Zhang Jingning¹,Song Yu¹,Liu Pei²,Wang Ziting³,Yang Zhaohua³,Xue Guangming¹,Jin Yirong¹^ORCID,Yu Haifeng¹

Affiliation:

1. Beijing Academy of Quantum Information Sciences, Beijing 100193, China

2. State Key Laboratory of Low Dimensional Quantum Physics, Department of Physics, Tsinghua University, Beijing 100084, China

3. Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China

Funder

Beijing National Science Foundation

National Natural Science Foundation of China

National Key Research and Development Program of China

Key-area Reasearch and Development Program of Guangdong Province

Publisher

AIP Publishing

Subject