Microstructure evolution and failure mechanism for Cu/Au Schottky contacts to InGaP layer
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1487439
Reference16 articles.
1. Vapor‐grown InGaP/GaAs solar cells
2. GaInP mass transport and GaInP/GaAs buried‐heterostructure lasers
3. Effects of strained‐layer structures on the threshold current density of AlGaInP/GaInP visible lasers
4. High‐efficiency InGaP light‐emitting diodes on GaP substrates
5. High performances and reliability of novel GaAs MSM photodetectors with InGaP buffer and capping layers
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Characterization of Conduction Mechanism in Cu Schottky Contacts to p-type Ge;Transactions on Electrical and Electronic Materials;2014-12-25
2. Stress Evolution During Annealing of Cu/Au, Cu/Ag and Au/Ag Bilayers;Journal of Nanoscience and Nanotechnology;2012-11-01
3. Interfacial reactions of Pt-based Schottky contacts on InGaP;Applied Physics Letters;2008-02-25
4. Diffusion barrier of sputtered W film for Cu Schottky contacts on InGaP layer;Thin Solid Films;2004-12
5. Properties of Cu/Au Schottky contacts on InGaP layer;Journal of Applied Physics;2003-09-15
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