Microstructure evolution and failure mechanism for Cu/Au Schottky contacts to InGaP layer

Author:

Liu Day-Shan,Lee Ching-Ting

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Characterization of Conduction Mechanism in Cu Schottky Contacts to p-type Ge;Transactions on Electrical and Electronic Materials;2014-12-25

2. Stress Evolution During Annealing of Cu/Au, Cu/Ag and Au/Ag Bilayers;Journal of Nanoscience and Nanotechnology;2012-11-01

3. Interfacial reactions of Pt-based Schottky contacts on InGaP;Applied Physics Letters;2008-02-25

4. Diffusion barrier of sputtered W film for Cu Schottky contacts on InGaP layer;Thin Solid Films;2004-12

5. Properties of Cu/Au Schottky contacts on InGaP layer;Journal of Applied Physics;2003-09-15

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