Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2912528
Reference21 articles.
1. Annotated tin whisker bibliography and anthology
2. Spontaneous growth mechanism of tin whiskers
3. Interdiffusion and reaction in bimetallic Cu-Sn thin films
4. Effects of reactive diffusion on stress evolution in Cu–Sn films
5. Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization
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