1. College of Integrated Circuit Science and Engineering, National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, No.9 Wenyuan Rd., Nanjing, China
2. National & Local Joint Engineering Laboratory for RF Integration and Micro-Packaging Technologies, Nanjing University of Posts and Telecommunications, No.9 Wenyuan Rd., Nanjing, China
3. Nanjing Electronic Devices Institute, State Key Laboratory of Wide-Bandgap Semiconductor Power Electronic Devices, No. 166 ZhengfangXi Rd., Nanjing; China