Thermal stability and dopant drive‐out characteristics of CoSi2polycide gates
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.352743
Reference9 articles.
1. Technology limitations for N/sup +//P/sup +/ polycide gate CMOS due to lateral dopant diffusion in silicide/polysilicon layers
2. WSi2and CoSi2as diffusion sources for shallow‐junction formation in silicon
3. Ultra Shallow Junction Formation Using Diffusion from Silicides: I . Silicide Formation, Dopant Implantation and Depth Profiling
4. Formation and thermal stability of CoSi2on polycrystalline Si
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1. Suppressing boron penetration and cobalt silicide agglomeration in deep submicron p-channel metal–oxide–semiconductor devices;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2002
2. Simultaneous Formation of Shallow Junctions and Gate Doping for Dual Gate Structures Using Cobalt Silicone as a Dopant Source;Journal of The Electrochemical Society;1999-10-01
3. Silicides and ohmic contacts;Materials Chemistry and Physics;1998-02
4. Ultrathin cobalt silicide layers formed by rapid thermal processing of metal on amorphous silicon;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;1997-07
5. Improved thermal stability of cobalt silicide formed by ion beam assisted deposition on polysilicon;Applied Surface Science;1995-10
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