Thermal stability enhancement of Cu/WN/SiOF/Si multilayers by post-plasma treatment of fluorine-doped silicon dioxide-Reference-Cited by-同舟云学术

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Thermal stability enhancement of Cu/WN/SiOF/Si multilayers by post-plasma treatment of fluorine-doped silicon dioxide

Published:1999-01 Issue:1 Volume:85 Page:473-477
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Lee Seoghyeong,Kim Dong Joon,Yang Sung-Hoon,Park Jeongwon,Sohn Seil,Oh Kyunghui,Kim Yong-Tae,Kim Jung-Yeul,Yeom Geun-Young,Park Jong-Wan

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.369410

Reference10 articles.

1. Flow Characteristics of SiOF Films in Room Temperature Chemical Vapor Deposition Utilizing Fluoro‐Trialkoxy‐Silane Group and Pure Water as Gas Sources

2. Effect of fluorine on dielectric properties of SiOF films

3. Effect of fluorine on moisture absorption and dielectric properties of SiOF films

4. Characterization of Stable Fluorine-Doped Silicon Oxide Film Prepared by Biased Helicon Plasma Chemical Vapor Deposition

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hygroscopic fluorine‐doped silicon oxide thin‐film‐based large‐area three‐layered moisture barrier using a roll‐to‐roll microwave plasma‐enhanced chemical vapor deposition system;Plasma Processes and Polymers;2022-06-02

2. Rapid thermal annealing of Cu/WNx/Si structures;Journal of Materials Science: Materials in Electronics;2003

3. Adhesion of Cu and low-k Dielectric Thin Films with Tungsten Carbide;Journal of Materials Research;2002-06

4. Surface Modification of Low Dielectric Fluorinated Amorphous Carbon Films by Nitrogen Plasma Treatment;Japanese Journal of Applied Physics;2001-10-15

5. Thermal Stability Enhancement of Cu Interconnects by Employing a Self-aligned MgO Layer Obtained From a Cu(Mg) Alloy Film;Japanese Journal of Applied Physics;2001-04-15

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