Direct wafer bonding technology for large-scale InGaAs-on-insulator transistors
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4891493
Reference23 articles.
1. (Invited) Heterogeneous Integration of III-V Devices and Si CMOS on a Silicon Substrate
2. Ultrathin compound semiconductor on insulator layers for high-performance nanoscale transistors
3. A III–V nanowire channel on silicon for high-performance vertical transistors
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