Improvement of the thermal stability of silver metallization
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Reference11 articles.
1. Encapsulation of Ag films on SiO2 by Ti reactions using Ag–Ti alloy/bilayer structures and an NH3 ambient
2. Thermal stability and adhesion improvement of Ag deposited on Pa-n by oxygen plasma treatment
3. Electromigration resistance of sputtered silver lines using different patterning techniques
4. Thickness dependence on the thermal stability of silver thin films
5. Dewetting Patterns and Molecular Forces: A Reconciliation
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