Electromigration critical length effect in Cu/oxide dual-damascene interconnects
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1418034
Reference6 articles.
1. Electromigration Reliability of Dual-Damascene Cu/Oxide Interconnects
2. Electromigration—A brief survey and some recent results
3. Electromigration in thin aluminum films on titanium nitride
4. Electromigration threshold in aluminum films
5. The electromigration short‐length effect in Ti‐AlCu‐Ti metallization with tungsten studs
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