A photoelastic and numeric study of the stress field in the vicinity of two interacting cracks: Stress intensity factors, T-stresses and higher order terms
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Publisher
AIP Publishing
Link
http://aip.scitation.org/doi/pdf/10.1063/5.0003507
Reference18 articles.
1. An improved normalization technique for white light photoelasticity
2. Linear least squares approach for evaluating crack tip fracture parameters using isochromatic and isoclinic data from digital photoelasticity
3. Experimental determination of stress field parameters in bi-material notches using photoelasticity
4. Derivation of complete crack-tip stress expansions from Westergaard–Sanford solutions
5. Analytical determination of coefficients in crack-tip stress expansions for a finite crack in an infinite plane medium
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1. Influence of Contact Stresses on Crack-Tip Stress Field: A Multiparameter Approach Using Digital Photoelasticity;Experimental Mechanics;2024-04-04
2. Experimental study on the interaction between two cracks by digital photoelasticity method: construction of the Williams series expansion;Procedia Structural Integrity;2022
3. Computational and experimental identification of coefficients of the Williams series expansion by considering higher order terms in the cracked specimens through digital image analysis;Procedia Structural Integrity;2022
4. Importance of the Higher Order Terms of the Williams series expansion: Experimental Aspects and Finite Element Simulations;Procedia Structural Integrity;2022
5. Holographic interferometry experiments and numerical analyses of the stress field on the Williams series expansion: higher – order terms;Procedia Structural Integrity;2022
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