Holographic interferometry experiments and numerical analyses of the stress field on the Williams series expansion: higher

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Holographic interferometry experiments and numerical analyses of the stress field on the Williams series expansion: higher – order terms

Published:2022 Issue: Volume:39 Page:761-769
ISSN:2452-3216
Container-title:Procedia Structural Integrity
language:en
Short-container-title:Procedia Structural Integrity

Author:

Belova O.N.,Stepanova L.V.

Publisher

Elsevier BV

Subject

General Engineering,Energy Engineering and Power Technology

Reference30 articles.

1. Experimental determination of stress field parameters in bi-material notches using photoelasticity;Ayatollahi;Materials & Design,2011

2. Dolgikh, V.S., Stepanova, L.V., 2020. A photoelastic and numeric study of the stress field in the vicinity of two interacting cracks: Stress intensity factors, T-stresses and higher order terms. AIP Conference Proceedings 2216, 020014.

3. Application of holographic interferometry in the analysis of stress state in a crack root area;Frankovsky;Applied Optics,2020

4. Digital image processing of photoelastic fringes – a new approach;Ganesan;Experimental techniques,2008

5. Holographic Interferometry: From History to Modern Applications;Georges;Optical Holography,2020

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Procedure of the overdeterminisctic method for finding the field expansion coefficients at the crack tip based on a finite element solution for the stress tensor components;Vestnik of Samara University. Natural Science Series;2024-07-03

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