The algorithm for the determination of the Williams asymptotic expansion coefficients for notched semidiscs using the photoelasticity method and finite element method-Reference-Cited by-同舟云学术

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The algorithm for the determination of the Williams asymptotic expansion coefficients for notched semidiscs using the photoelasticity method and finite element method

Published:2020 Issue: Volume: Page:
ISSN:0094-243X
Container-title:28TH RUSSIAN CONFERENCE ON MATHEMATICAL MODELLING IN NATURAL SCIENCES
language:
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Author:

Stepanova Larisa V.

Publisher

AIP Publishing

Link

http://aip.scitation.org/doi/pdf/10.1063/5.0003506

Reference20 articles.

1. Linear least squares approach for evaluating crack tip fracture parameters using isochromatic and isoclinic data from digital photoelasticity

2. Derivation of complete crack-tip stress expansions from Westergaard–Sanford solutions

3. Analytical determination of coefficients in crack-tip stress expansions for a finite crack in an infinite plane medium

4. Evaluation of stress field parameters in fracture mechanics by photoelasticity—Revisited

5. L. Stepanova and S. Bronnikov, J. of Phys.: Conf. Ser. 973(1) 012046 (2018).

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. To the scrutiny of the experiential and computational elicitation of factors of the Williams multi-parameter expansion;Vestnik of Samara University. Natural Science Series;2023-03-23

2. Experimental study on the interaction between two cracks by digital photoelasticity method: construction of the Williams series expansion;Procedia Structural Integrity;2022

3. Computational and experimental identification of coefficients of the Williams series expansion by considering higher order terms in the cracked specimens through digital image analysis;Procedia Structural Integrity;2022

4. Importance of the Higher Order Terms of the Williams series expansion: Experimental Aspects and Finite Element Simulations;Procedia Structural Integrity;2022

5. Holographic interferometry experiments and numerical analyses of the stress field on the Williams series expansion: higher – order terms;Procedia Structural Integrity;2022

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