Formation of aluminum oxynitride diffusion barriers for Ag metallization
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.123130
Reference13 articles.
1. Copper-based metallization and interconnects for ultra-large-scale integration applications
2. Encapsulation of Ag films on SiO2 by Ti reactions using Ag–Ti alloy/bilayer structures and an NH3 ambient
3. Low-temperature passivation of copper by doping with Al or Mg
4. Advanced multilayer metallization schemes with copper as interconnection metal
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