Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1348324
Reference16 articles.
1. Electromigration in thin aluminum films on titanium nitride
2. Electromigration Induced Failure as a Function of Via Interface
3. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
4. Behavior of electromigration‐induced gaps in a layered Al line observed by in situ sideview transmission electron microscopy
5. Coating, Mechanical Constraints, and Pressure Effects on Electromigration
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1. Electromigration in electroplated Cu(Ag) alloy thin films investigated by means of single damascene Blech structures;Microelectronic Engineering;2009-12
2. Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes;Journal of Applied Physics;2006-03
3. Electromigration Studies of Sn(Cu) and Sn(Ni) Alloy Stripes;Journal of Materials Research;2005-08-01
4. Effect of current crowding and Joule heating on electromigration-induced failure in flip chip composite solder joints tested at room temperature;Journal of Applied Physics;2005-07
5. In situobservation of electromigration-induced void migration in dual-damascene Cu interconnect structures;Applied Physics Letters;2004-09-27
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