Role of stress in irradiation‐then‐anneal technique used for improving radiation hardness of metal‐insulator‐semiconductor devices
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.107819
Reference14 articles.
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4. Hole and electron current transport in metal-oxide-nitride-oxide-silicon memory structures
5. Improvement of hot-electron-induced degradation in MOS capacitors by repeated irradiation-then-anneal treatments
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1. Oxide Traps, Border Traps, and Interface Traps in SiO2;Defects in Microelectronic Materials and Devices;2008-11-19
2. Reduction of the annealing temperature of radiation-induced defects in ion-implanted MOS structures;Applied Physics A: Materials Science & Processing;2004-03-01
3. Unified model of hole trapping, 1/f noise, and thermally stimulated current in MOS devices;IEEE Transactions on Nuclear Science;2002-12
4. Thermally stimulated current in SiO2;Microelectronics Reliability;1999-09
5. Use of X-ray irradiation for annealing of radiation defects introduced by ion implantation in Si–SiO2 structures;Solid-State Electronics;1998-10
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