Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods-Reference-Cited by-同舟云学术

Effect of grain boundary deformation on mechanical properties in nanocrystalline Cu film investigated by using phase field and molecular dynamics simulation methods

Published:2020-03-31 Issue:12 Volume:127 Page:125303
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Zhang Meng¹^ORCID,Chen Juan¹^ORCID,Xu Ting¹,Li Meie¹^ORCID,Sun Kun¹^ORCID,Fang Liang¹²^ORCID

Affiliation:

1. State Key Laboratory for Mechanical Behavior of Materials, Xi’an Jiaotong University, Xi’an 710049, People’s Republic of China

2. School of Mechanical and Electrical Engineering, Xiamen University Tan Kah Kee College, Zhangzhou 363105, People's Republic of China

Funder

Foundation for Innovative Research Groups of the National Natural Science Foundation of China

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5136326

Reference80 articles.

1. Direct observation of deformation twinning under stress gradient in body-centered cubic metals

2. Formation of aluminide phases on electrodeposited nanocrystalline nickel

3. An equivalent local constitutive model for grain size dependent deformation of NiTi polycrystalline shape memory alloys

4. Microstructure and tensile properties of nanocrystalline (FeNiCoCu)1−xTixAlx high entropy alloys processed by high pressure torsion

5. Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study

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