Author:
Hsieh J. Y.,Chen J. L.,Chen C.,Lin H. C.,Yang S. S.,Hwang C. C.
Abstract
Abstract
Influences of temperature and Sn-Cu droplet’s composition on reactive wettings of Cu(100), Cu(110), and Cu(111) surfaces were analyzed, by using molecular dynamics (MD) calculations. As a result, the spreading on Cu(110)(Cu(100)) has the fastest (slowest) wetting kinetics. A higher temperature or a diluter Cu content in the Sn-Cu alloy droplet results in a higher wettability. Moreover, this work has addressed a theory for positioning the interface separating the liquidus and solidus alloys in the spreading film to confirm the hypothesis that the reactive wetting will come to the end when the interface saturates with the temperature-dependent solidus weight fraction of Cu.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Electronic, Optical and Magnetic Materials
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