Rapid diagnosis of electromigration induced failure time of Pb-free flip chip solder joints by high resolution synchrotron radiation laminography
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.3628342
Reference16 articles.
1. Recent advances on electromigration in very-large-scale-integration of interconnects
2. High-resolution three-dimensional imaging of flat objects by synchrotron-radiation computed laminography
3. Investigation of hybrid pixel detector arrays by synchrotron-radiation imaging
4. Synchrotron-radiation computed laminography for high-resolution three-dimensional imaging of flat devices
5. Phase-contrast and holographic computed laminography
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2. Thermal boundary resistance correlated with strain energy in individual Si film-wafer twist boundaries;Materials Today Physics;2018-08
3. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation;Scientific Reports;2017-12
4. A statistical mechanics model to predict electromigration induced damage and void growth in solder interconnects;Physica A: Statistical Mechanics and its Applications;2017-02
5. Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling;Acta Materialia;2016-09
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