Thermal stability study of TiN/TiSi2diffusion barrier between Cu andn+Si
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.356568
Reference24 articles.
1. Diffusion barriers in thin films
2. Barrier layers: Principles and applications in microelectronics
3. The formation of Cu3Si: Marker experiments
4. Diffusion barrier study on TaSix and TaSixNy
5. WxN1−x alloys as diffusion barriers between Al and Si
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