Strain gradients in Al‐2% Cu thin films
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.349446
Reference33 articles.
1. The Role of Thin Film Materials on the Technology of Integrated Circuit Fabrication
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5. Thermal dependence of voiding in narrow aluminum microelectronic interconnects
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