The effect of thermal mismatch on the thermal conductance of Al/SiC and Cu/diamond composites-Reference-Cited by-同舟云学术

The effect of thermal mismatch on the thermal conductance of Al/SiC and Cu/diamond composites

Published:2020-01-31 Issue:4 Volume:127 Page:045101
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Sun Zhibo¹,Tian Zhuoran¹,Weng Lin²,Liu Yue¹,Zhang Jingjing¹,Fan Tongxiang¹^ORCID

Affiliation:

1. State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China

2. School of Urban Railway Transportation, Shanghai University of Engineering Science, Shanghai 201620, People’s Republic of China

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5133982

Reference40 articles.

1. Metal-matrix composites for electronic packaging

2. Aluminum composite materials for multichip modules

3. Thermal expansion behavior of particulate metal-matrix composites

4. Review of metal matrix composites with high thermal conductivity for thermal management applications

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