Hollow cathode reactive sputter etching—A new high‐rate process
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.94172
Reference9 articles.
1. Profile control by reactive sputter etching
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5. Anisotropic plasma etching of polysilicon
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