Formation ofn+pshallow junction by As+implantation through CoSi2film
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.354497
Reference18 articles.
1. Process limitation and device design tradeoffs of self-aligned TiSi/sub 2/ junction formation in submicrometer CMOS devices
2. The Effects of Titanium Silicide Formation on Dopant Redistribution
3. Degradation of doped Si regions contacted with transition‐metal silicides due to metal‐dopant compound formation
4. Comparison between CoSi2 and TiSi2 as dopant source for shallow silicided junction formation
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1. Yield enhancement using source/drain BF2+ implant process optimization;2010 IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC);2010-07
2. Epitaxial growth of CoSi2 on Si(001) by reactive deposition epitaxy: Island growth and coalescence;Thin Solid Films;2006-12
3. CoSi2 growth on Si(001) by reactive deposition epitaxy: Effects of high-flux, low-energy ion irradiation;Journal of Applied Physics;2006-07
4. Formation and Characterization of NiSi-Silicided n+p Shallow Junctions;Japanese Journal of Applied Physics;2006-03-08
5. Growth of CoSi2 on Si(001) by reactive deposition epitaxy;Journal of Applied Physics;2005-02-15
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