Properties of titanium nitride thin films deposited by rapid‐thermal‐low‐pressure‐metalorganic‐chemical‐vapor‐deposition technique using tetrakis (dimethylamido) titanium precursor
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.349214
Reference27 articles.
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3. Properties and microelectronic applications of thin films of refractory metal nitrides
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