Mechanisms of interdiffusion in copper/nickel thin‐film couples
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.336552
Reference30 articles.
1. Qualitative observations on the diffusion of copper and gold through a nickel barrier
2. Diffusion barriers in layered contact structures
3. Material Characterization of Ti-Cu-Ni-Au(TCNA)-A New Low Cost Thin Film Conductor System
4. Summary Abstract: Auger study of interdiffusion in Cu/Ni thin films
5. A study of interdiffusion in multilayer Cu/Ni films by Auger electron depth profiling
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