A study of interdiffusion in multilayer Cu/Ni films by Auger electron depth profiling
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials
Reference11 articles.
1. A formalism for extracting diffusion coefficients from concentration profiles
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4. Depth resolution and surface roughness effects in sputter profiling of NiCr multilayer sandwich samples using Auger electron spectroscopy
5. Study of preferential sputtering on binary alloy by in-situ Auger measurement of sputtered and sputter-deposited surfaces
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1. NiCu;Magnetic Properties of Metals: Magnetic and Electric Properties of Magnetic Metallic Multilayers;2022
2. Atomic mechanisms of interdiffusion in metallic multilayers;Materials Science and Engineering: C;2007-09
3. Ion-beam characterization in superlattices;Handbook of Thin Films;2002
4. Influence of depth resolution on interdiffusion measurements in polycrystalline Cu/Pd multilayers;SURF INTERFACE ANAL;2000
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