Heat conduction in polymer chains with controlled end-to-end distance
Author:
Affiliation:
1. Department of Chemistry, University of Pennsylvania, Philadelphia, Pennsylvania 19104, USA
2. School of Chemistry, Tel Aviv University, Tel Aviv 69978, Israel
Funder
XSEDE
National Science Foundation
Publisher
AIP Publishing
Subject
Physical and Theoretical Chemistry,General Physics and Astronomy
Link
http://aip.scitation.org/doi/am-pdf/10.1063/5.0023085
Reference45 articles.
1. Tuning the thermal conductivity of polymers with mechanical strains
2. Molecular engineered conjugated polymer with high thermal conductivity
3. Strain effects on the anisotropic thermal transport in crystalline polyethylene
4. 1D-to-3D transition of phonon heat conduction in polyethylene using molecular dynamics simulations
5. The plastics revolution: how chemists are pushing polymers to new limits
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