A technique to measure the thermal resistance at the interface between a micron size particle and its matrix in composite materials-Reference-Cited by-同舟云学术

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A technique to measure the thermal resistance at the interface between a micron size particle and its matrix in composite materials

Published:2018-09-14 Issue:10 Volume:124 Page:105303
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Goni Miguel¹^ORCID,Patelka Maciej²,Ikeda Sho²,Hartman Terry²,Sato Toshiyuki²^ORCID,Schmidt Aaron J.¹^ORCID

Affiliation:

1. Mechanical Engineering Department, Boston University, Boston, Massachusetts 02215, USA

2. NAMICS North American R&D Center - Diemat, Inc., Byfield, Massachusetts 01922, USA

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5048110

Reference18 articles.

1. Advanced Thermal Management Materials

2. Advanced Materials for Thermal Management of Electronic Packaging

3. Thermal Interface Materials - A Review of the State of the Art

4. Selective interfacial bonding in Al(Si)–diamond composites and its effect on thermal conductivity

5. Silver-based diamond composites with highest thermal conductivity

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1. Sensing depths in frequency domain thermoreflectance;Journal of Applied Physics;2022-06-28

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