1. Ellsworth MJ. Chip power density and module cooling technology projections for the current decade. In: Proceedings of the Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, vol. 2. Las Vegas, Nevada, USA; 2004. p. 707–8.
2. Advances in composite materials for thermal management in electronic packaging;Zweben;JOM,1998
3. Zweben C. Thermal management and electronic packaging applications. In: ASM Handbook, vol. 21. 2001. p. 1078–84.
4. Powder metallurgy processing of thermal management materials for microelectronic applications;German;Int J Powder Metall,1994
5. Thermal properties of electronic materials;Evans,1998