Formation of Cu–Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2720297
Reference14 articles.
1. Copper Wafer Bonding
2. System-level performance evaluation of three-dimensional integrated circuits
3. Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction
4. Effect of Contamination on the Adhesion of Metallic Couples in Ultra‐High Vacuum
5. Proceedings of the IEEE 2003 International Interconnect Technology Conference;Tadepalli R.,2003
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