Quantifying the temperature of heated microdevices using scanning thermal probes
Author:
Affiliation:
1. Department of Mechanical Engineering, University of Michigan, Ann Arbor, Michigan 48109, USA
2. Department of Materials Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, USA
Funder
Office of Naval Research Global
U.S. Department of Energy
Army Research Office
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
https://aip.scitation.org/doi/am-pdf/10.1063/5.0046789
Reference28 articles.
1. Electron Thermal Microscopy
2. Thermal Metrology of Silicon Microstructures Using Raman Spectroscopy
3. Nanogap near-field thermophotovoltaics
4. Laser heating of scanning probe tips for thermal near-field spectroscopy and imaging
5. Giant Enhancement in Radiative Heat Transfer in Sub-30 nm Gaps of Plane Parallel Surfaces
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1. Local Heat Dissipation and Elasticity of Suspended Silicon Nanowires Revealed by Dual Scanning Electron and Thermal Microscopies;Small;2023-12-13
2. Quantitative Mapping of Unmodulated Temperature Fields with Nanometer Resolution;ACS Nano;2021-12-27
3. Near-field thermophotovoltaics for efficient heat to electricity conversion at high power density;Nature Communications;2021-07-16
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