Asymmetrical interfacial reactions of Ni/SAC101(NiIn)/Ni solder joint induced by current stressing
Author:
Affiliation:
1. Department of Materials Science and Engineering, National Cheng Kung University, No. 1, University Road, Tainan 70101, Taiwan
Funder
Ministry of Science and Technology, Taiwan
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5011667
Reference17 articles.
1. Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint
4. Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
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