Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress-Reference-Cited by-同舟云学术

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Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress

Published:2013-03 Issue:5 Volume:68 Page:317-320
ISSN:1359-6462
Container-title:Scripta Materialia
language:en
Short-container-title:Scripta Materialia

Author:

Chen Wei-Yu,Chiu Tsung-Chieh,Lin Kwang-Lung,Wu Albert T.,Jang Wei-Luen,Dong Chung-Li,Lee Hsin-Yi

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering

Reference14 articles.

1. Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes

2. Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

3. Effect of current crowding on void propagation at the interface between intermetallic compound and solder in flip chip solder joints

4. Study of electromigration-induced Cu consumption in the flip-chip Sn∕Cu solder bumps

5. Electromigration in flip chip solder joints under extra high current density

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