High‐temperature ohmic contact to n‐type 6H‐SiC using nickel
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.358936
Reference4 articles.
1. Models for contacts to planar devices
2. Algorithms for the rapid simulation of Rutherford backscattering spectra
3. Platinum silicide formation under ultrahigh vacuum and controlled impurity ambients
4. XPS study of the chemical structure of the nickel/silicon interface
Cited by 181 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Application of bulk silicon carbide technology in high temperature MEMS sensors;Materials Science in Semiconductor Processing;2024-04
2. Tunneling current through non-alloyed metal/heavily-doped SiC interfaces;Materials Science in Semiconductor Processing;2024-03
3. Metal-ferroelectric AlScN-semiconductor memory devices on SiC wafers;Applied Physics Letters;2023-09-18
4. Numerical simulation on controlling the front-side temperature of thinned SiC substrate during ohmic contact to Ni or Ti using back-side laser annealing;Journal of Applied Physics;2022-07-21
5. MEMS Thermocouple Sensor Based on 4H-Silicon-Carbide-On-Insulator (4H-SiCOI);IEEE Sensors Journal;2022-07-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3