On the mechanism of aluminum via fill by reflow and forcefill as studied by transmission electron microscopy-Reference-Cited by-同舟云学术

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On the mechanism of aluminum via fill by reflow and forcefill as studied by transmission electron microscopy

Published:1999-01 Issue:1 Volume:85 Page:571-577
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Dirks A. G.,Webster M. N.,Turner P.,Rich P.,Butler D. C.

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.369491

Reference16 articles.

1. Molecular dynamics analysis of reflow process of sputtered aluminum films

2. High pressure aluminium for sub-micron vias using a liquid transducer

3. Fabrication of Planar and Cross-Sectional TEM Specimens Using a Focused Ion Beam

4. Theory of self-diffusion at and growth of Al(111)

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recovery and recrystallization behavior of aluminum processed by extrusion-preceded equal channel angular pressing;International Journal of Materials Research;2009-06-01

2. Orientationally ordered ridge structures of aluminum films on hydrogen terminated silicon;Thin Solid Films;2006-12

3. Modeling of aluminum via filling by forcefill;Journal of Applied Physics;2003-05

4. Study on the characteristics of alumdinum thin films prepared by atomic layer deposition;Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films;2002

5. Submicron Via-Hole Filling using Al Low-Pressure Seed Process;Japanese Journal of Applied Physics;2001-08-15

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