Band alignment at AlN/Si (111) and (001) interfaces
Author:
Affiliation:
1. Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina 27695, USA
2. Department of Physics, North Carolina State University, Raleigh, North Carolina 27695, USA
Funder
Office of Naval Research (ONR)
U.S. Department of Education (DoED)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4927515
Reference44 articles.
1. III–nitrides: Growth, characterization, and properties
2. Impact of film thickness on the temperature-activated leakage current behavior of sputtered aluminum nitride thin films
3. Thermal stability and desorption of Group III nitrides prepared by metal organic chemical vapor deposition
4. The intrinsic thermal conductivity of AIN
5. Impact of annealing temperature on the mechanical and electrical properties of sputtered aluminum nitride thin films
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Determination of band offsets at the interfaces of NiO, SiO2, Al2O3, and ITO with AlN;Journal of Applied Physics;2024-06-17
2. Direct high-temperature growth of GaN on Si using trimethylaluminum preflow enabling vertically-conducting heterostructures;Japanese Journal of Applied Physics;2024-06-03
3. InterMat: accelerating band offset prediction in semiconductor interfaces with DFT and deep learning;Digital Discovery;2024
4. Research Progress and Development Prospects of Enhanced GaN HEMTs;Crystals;2023-06-04
5. Momentum-resolved electronic structure and band offsets in an epitaxial NbN/GaN superconductor/semiconductor heterojunction;Science Advances;2021-12-24
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3