Electrical characterization of stressed and broken down SiO2 films at a nanometer scale using a conductive atomic force microscope
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1430542
Reference31 articles.
1. Exploratory observations of post‐breakdown conduction in polycrystalline‐silicon and metal‐gated thin‐oxide metal‐oxide‐semiconductor capacitors
2. Soft breakdown of ultra-thin gate oxide layers
3. Impact ionization, trap creation, degradation, and breakdown in silicon dioxide films on silicon
4. Degradation and hard breakdown transient of thin gate oxides in metal–SiO2–Si capacitors: Dependence on oxide thickness
5. On the breakdown statistics of very thin SiO2 films
Cited by 103 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Smart Measurement System for the Combined Nanoscale and Device Level Characterization of Electron Devices: Implementation Using Ink-Jet Printing Technologies;IEEE Transactions on Nanotechnology;2023
2. Electrical passivation of stacking-fault crystalline defects in MOS capacitors on cubic silicon carbide (3C-SiC) by post-deposition annealing;Journal of Applied Physics;2022-12-28
3. Exploiting the KPFM capabilities to analyze at the nanoscale the impact of electrical stresses on OTFTs properties;Solid-State Electronics;2021-12
4. On the origin of the premature breakdown of thermal oxide on 3C-SiC probed by electrical scanning probe microscopy;Applied Surface Science;2020-10
5. Metal-oxide resistive random access memory (RRAM) technology: Material and operation details and ramifications;Advances in Non-Volatile Memory and Storage Technology;2019
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3