Author:
Su C. M.,Bohn H. G.,Robrock K.‐H.,Schilling W.
Subject
General Physics and Astronomy
Cited by
23 articles.
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1. Massive-Scale Statistical Studies for Electromigration;Electromigration in Metals;2022-04-30
2. Vapour phase co-deposition of Al-Cu thin film alloys;physica status solidi (a);2013-05
3. Investigation of Cu–Al surface alloy formation on Cu substrate;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2010-03
4. Diffusion during annealing of Al/Cu/Fe thin films;Thin Solid Films;2007-06
5. Mechanical Properties;Materials Science in Microelectronics II;2006