A study of the initial growth kinetics of the copper‐aluminum thin‐film interface reaction by in situ x‐ray diffraction and Rutherford backscattering analysis
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.333960
Reference13 articles.
1. Growth kinetics of the θ phase in AlCu thin film bilayers
2. Investigation of diffusion in the CuAl thin film system
3. An in situ X-ray study of phase formation in CuAl thin film couples
4. A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples
5. Investigation of interfacial reactions in thin film couples of aluminum and copper by measurement of low temperature contact resistance
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