Numerical simulation of interfacial delamination between SiO2 thin film and polymeric substrate
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Publisher
AIP Publishing
Link
http://aip.scitation.org/doi/pdf/10.1063/1.5140287
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1. Buckling-delamination and cracking of thin titanium films under compression: Experimental and numerical studies
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4. The effect of interface adhesion on buckling and cracking of hard thin films
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