Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly-Reference-Cited by-同舟云学术

Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Published:2011-06-27 Issue:26 Volume:98 Page:264104
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Carlson Andrew,Kim-Lee Hyun-Joon,Wu Jian,Elvikis Paulius,Cheng Huanyu,Kovalsky Anton,Elgan Steven,Yu Qingmin,Ferreira Placid M.,Huang Yonggang,Turner Kevin T.,Rogers John A.

Funder

U.S. Department of Energy

National Science Foundation

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3605558

Reference24 articles.

1. Heterogeneous Three-Dimensional Electronics by Use of Printed Semiconductor Nanomaterials

2. Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates

3. Stretchable and Foldable Silicon Integrated Circuits

4. Printed Assemblies of Inorganic Light-Emitting Diodes for Deformable and Semitransparent Displays

5. A Conformal, Bio-Interfaced Class of Silicon Electronics for Mapping Cardiac Electrophysiology

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