Author:
Peng Bo,Huang YongAn,Yin ZhouPing,Xiong YouLun
Subject
General Physics and Astronomy
Reference22 articles.
1. M. Feil, C. Adler, D. Hemmetzberger, M. Konig, and K. Bock, 54th Electronic Components and Technology Conference, Las Vegas, NV, 1-4 June 2004, Vol. 1, p. 35.
2. A. C. M. Chong and Y. M. Cheung, 5th International Conference on Electronic Packaging Technology, Shanghai, 28-30 October 2003, Vol. 1, p. 44.
3. Static analysis of the die picking process
4. Study in IC chip failure during pick-up process by using experimental and finite element methods
5. Analysis of stresses in adhesive joints applicable to IC chips using symbolic manipulation and the numerical method
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