Early stages of soldering reactions
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2058186
Reference47 articles.
1. C. Lea,A Scientific Guide to Surface Mount Technology(Electrochemical Publications, Ayr, Scotland, 1988), p. 309.
2. Reaction-Diffusion in the Cu–Sn System
3. The growth of Cu-Sn intermetallics at a pretinned copper-solder interface
4. The growth of Cu-Sn intermetallics at a pretinned copper-solder interface
5. Reactions of solid copper with pure liquid tin and liquid tin saturated with copper
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