Reactive ion etching of high‐aspect‐ratio 100 nm linewidth features in tungsten-Reference-Cited by-同舟云学术

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Reactive ion etching of high‐aspect‐ratio 100 nm linewidth features in tungsten

Published:1994-04-18 Issue:16 Volume:64 Page:2172-2174
ISSN:0003-6951
Container-title:Applied Physics Letters
language:en
Short-container-title:Appl. Phys. Lett.

Author:

Chu W.,Foster K. W.,Shirey L. M.,Rhee K. W.,Kosakowski J.,Isaacson I. P.,McCarthy D.,Eddy C. R.,Dobisz E. A.,Marrian C. R. K.,Peckerar M. C.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Link

http://aip.scitation.org/doi/pdf/10.1063/1.111666

Reference10 articles.

1. Fabrication of high performance 512K static-random access memories in 0.25 μm complementary metal–oxide semiconductor technology using x-ray lithography

2. Prospects for x-ray lithography

3. Patterning tungsten films with an electron beam lithography system at 50 keV for x-ray mask applications

4. Energy density function determination in very-high-resolution electron-beam lithography

5. Fabrication of 50 nm line-and-space x-ray masks in thick Au using a 50 keV electron beam system

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1. Laser ablation of high-aspect-ratio hole arrays in tungsten for X-ray applications;Microelectronic Engineering;2019-03

2. Tungsten–Carbon Nanotube Composite Photonic Crystals as Thermally Stable Spectral‐Selective Absorbers and Emitters for Thermophotovoltaics;Advanced Energy Materials;2018-08-13

3. Fabrication of high aspect ratio tungsten nanostructures on ultrathin c-Si membranes for extreme UV applications;Nanotechnology;2015-12-02

4. Electron microscopy of quantum dots;Journal of Microscopy;2014-11-18

5. Twelve nanometer half-pitch W–Cr–HSQ trilayer process for soft x-ray tungsten zone plates;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-11

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