Ohmic contacts top‐type InP using Be‐Au metallization

Author:

Temkin H.,McCoy R. J.,Keramidas V. G.,Bonner W. A.

Publisher

AIP Publishing

Subject

Physics and Astronomy (miscellaneous)

Cited by 50 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Wet Chemical Treatment and Mg Doping of p‐InP Surfaces for Ohmic Low‐Resistive Metal Contacts;Advanced Engineering Materials;2023-07-28

2. Contact Property of Au on p-InP;Materials in Environmental Engineering;2017-08-21

3. Influence of a Barrier Layer on the Formation of AuBe Ohmic Contact With the p-GaAs Bases of Heterojunction Bipolar Transistors;IEEE Transactions on Electron Devices;2011-08

4. Microstructural and interfacial properties of the Ru/p-InP(100) heterostructures;Journal of Physics and Chemistry of Solids;2001-04

5. Effect of the first antimony layer on AuZn ohmic contacts to p-type InP;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2000

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