Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1370985
Reference6 articles.
1. New Pb‐free solder alloy with superior mechanical properties
2. Fabrication of GaN mesa structures
3. Contact resistance of silver‐doped Y‐Ba‐Cu‐O in a magnetic field
4. Large anisotropic thermal conductivity in synthetic diamond films
5. Broad-range, latchable reconfiguration of Bragg wavelength in optical gratings
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